3d integrations and methods of making thereof
AssigneeBroadPak Corporation
InventorFarhang YAZDANI
Life of this patent
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Abstract
Semiconductor packages are described which increase the density of electronic components within. The semiconductor package may incorporate interposers with cavities formed into the top and/or bottom. The cavities may then be used as locations for the electronic components. Alternatively, narrow spacer interposers may be used to space apart standard more laterally elongated interposers to form the indentations used to house the electronic components. The semiconductor package designs described herein may be used to reduce footprint, reduce profile and increase electronic component and transistor density for semiconductor products.
Claims20
An electronic package comprising:
- one or more cavities;
- a first substrate, wherein
- the first substrate having a substrate surface, and
- the first substrate is substantially planar and comprises of a first plurality of substrate vias and Redistribution Layers (RDLs) and a first plurality of said one or more cavities, wherein the first plurality of said one or more cavities is formed in the first substrate having said Redistribution layers (RDLs);
- a second substrate;
- and
- one standoff substrate, wherein
- the one standoff substrate positioned between the first substrate and the second substrate,
- only the one standoff substrate is positioned between the first substrate and the second substrate,
- the one standoff substrate is affixed to each of the first substrate and the second substrate,
- the one standoff substrate forms a clearance between the first substrate and the second substrate, and
- the one standoff substrate comprises an intervening plurality of standoff substrate vias passing through the entire thickness of the one standoff substrate;
- and
- a plurality of electronic components located within the clearance and/or within said one or more cavities, wherein
- the plurality of electronic components including a first electronic component and a second electronic component, and
- the first plurality of said one or more cavities are both formed into the substrate surface of said first substrate.
Dependencies are inferred from the claim text.