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US 2022/0189862 A1Published application
Redistribution layer structure
AssigneeInnolux Corporation
InventorsHung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang
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Abstract
A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer and a first dielectric layer disposed on the first metal layer. A range of a difference between a coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is 0% to 70% of the coefficient of thermal expansion of the first dielectric layer.
Claims20
A redistribution layer structure, comprising:
- a first metal layer;
- and
- a first dielectric layer, disposed on the first metal layer,
- wherein a range of a difference between a coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is 0% to 70% of the coefficient of thermal expansion of the first dielectric layer.
1 more element
A redistribution layer structure, comprising:
- a first redistribution layer, comprising:
- a first metal layer;
- and
- a first dielectric layer, disposed on the first metal layer;
- and
- a second redistribution layer, disposed on the first redistribution layer, comprising:
- a second metal layer, disposed on the first dielectric layer;
- and
- a second dielectric layer is disposed on the second metal layer,
- wherein a range of a difference between a coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is 0% to 70% of the coefficient of thermal expansion of the first dielectric layer,
- wherein a range of a difference between a coefficient of thermal expansion of the second dielectric layer and a coefficient of thermal expansion of the second metal layer is 0% to 70% of the coefficient of thermal expansion of the second dielectric layer.
8 more elements
Dependencies are inferred from the claim text.