US 2022/0189861 A1 · HERMETIC SEALING STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

Abstract

Disclosed herein are microelectronic assemblies including microelectronic components coupled by direct bonding, and related structures and techniques. In some embodiments, a microelectronic assembly may include a first microelectronic component including a first guard ring extending through at least a portion of a thickness of and along a perimeter; a second microelectronic component including a second guard ring extending through at least a portion of a thickness of and along a perimeter, where the first and second microelectronic components are coupled by direct bonding; and a seal ring formed by coupling the first guard ring to the second guard ring. In some embodiments, a microelectronic assembly may include a microelectronic component coupled to an interposer that includes a first liner material at a first surface; a second liner material at an opposing second surface; and a perimeter wall through the interposer and connected to the first and second liner materials.

Claims20

Dependent claims

A microelectronic assembly, comprising:

an interposer, including a dielectric material, comprising:
a first liner material at a first surface;
a second liner material at an opposing second surface;
and
a perimeter wall through the dielectric material and connected to the first and second liner materials;
and
a microelectronic component coupled to the second surface of the interposer by a direct bonding region.

4 more elements

Dependencies are inferred from the claim text.

Hermetic sealing structures in microelectronic assemblies having direct bonding

Life of this patent

Hermetic sealing structures in microelectronic assemblies having direct bonding

Life of this patent

Abstract

Claims20