Semiconductor package

A semiconductor package, comprising:

• a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface;
• a heat-dissipating member disposed on the inactive surface of the semiconductor chip and comprising graphite;
• an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member;
• a capping metal layer disposed directly between the heat-dissipating member and the encapsulant;
• and
• a connection structure disposed on the active surface of the semiconductor chip and comprising a redistribution layer electrically connected to the connection pad;
• a backside redistribution layer on the encapsulant;
• and
• a via passing through the encapsulant, and connecting the backside redistribution layer to the capping metal layer.

A semiconductor package, comprising:

• a semiconductor chip having a first surface, on which a connection pad is disposed, and a second surface opposite to the first surface;
• a heat-dissipating member disposed on the second surface of the semiconductor chip and comprising graphite;
• an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member;
• a capping metal layer disposed directly between the heat-dissipating member and the encapsulant;
• and
• a connection structure disposed on the first surface of the semiconductor chip and comprising a redistribution layer electrically connected to the connection pad.