Semiconductor apparatus, manufacturing method for semiconductor apparatus, and power converter

A semiconductor apparatus comprising:

• a semiconductor device;
• a lead frame to which the semiconductor device is bonded;
• an insulating layer on which the lead frame is provided;
• a metal base plate provided on a face of the insulating layer opposite to a face on which the lead frame is provided;
• a sealing member to seal the semiconductor device, the lead frame, the insulating layer, and the metal base plate in such a way that a portion of the lead frame and at least one portion of the metal base plate are exposed;
• a support frame having at least one opening in which the at least one exposed portion of the metal base plate exposed from the sealing member is inserted;
• and
• a heat dissipating member that is provided with multiple fins formed by folding a metal plate and that is welded to a part of the at least one exposed portion of the metal base plate inserted in the at least one opening and to the support frame.

A manufacturing method for a semiconductor apparatus, comprising:

• bonding a semiconductor device to a lead frame;
• forming a sealing member, after stacking in a mold, a metal base plate, an insulating layer, and the lead frame to which the semiconductor device is bonded, to seal the semiconductor device, the lead frame, the insulating layer, and the metal base plate in such a way that a portion of the lead frame and a portion of the metal base plate are exposed from the sealing member;
• and
• welding a heat dissipating member having multiple fins formed by folding a metal plate to both a part of the exposed portion inserted into the opening and the support frame after inserting the exposed portion of the metal base plate exposed from the sealing member into the opening of the support frame.