Suspended semiconductor dies

An electronic device, comprising:

• a printed circuit board (PCB) having a first surface and a second surface opposing the first surface;
• an orifice in the PCB extending from the first surface to the second surface;
• a semiconductor die suspended above the first surface and vertically aligned with the orifice;
• a first cap coupled to the first surface and covering the semiconductor die;
• and
• a second cap coupled to the second surface and covering the orifice.

A method, comprising:

• covering a first end of an orifice in a printed circuit board (PCB) with a semiconductor die, the orifice extending through the PCB;
• applying a suction to a second end of the orifice opposing the first end to hold the semiconductor die in place;
• coupling aluminum bond wires to the semiconductor die and the PCB;
• and
• causing the semiconductor die to elevate above the PCB by ceasing to apply the suction.

A semiconductor package, comprising:

• a conductive terminal exposed to an exterior surface of the semiconductor package;
• a first semiconductor die coupled to the conductive terminal by a first bond wire;
• and
• a second semiconductor die suspended above the first semiconductor die, the second semiconductor die coupled to the first semiconductor die by a second bond wire.

A method, comprising:

• positioning a first semiconductor die in an open cavity of a semiconductor package;
• dispensing an adhesive on the first semiconductor die;
• coupling a second semiconductor die to the first semiconductor die using the adhesive;
• coupling the first semiconductor die to a conductive terminal of the semiconductor package using a first bond wire;
• coupling the second semiconductor die to the first semiconductor die using a second bond wire;
• and
• causing the second semiconductor die to elevate above the first semiconductor die by removing the adhesive.