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US 2022/0189856 A1Published application
Die attachment for semiconductor device packaging and method therefor
AssigneeNXP B.V.
InventorsYeou Chian Chang, Chao Hui Huang
Life of this patent
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Abstract
A method of manufacturing a semiconductor device is provided. The method includes forming a package leadframe including leads and a die paddle. A cavity is formed in the die paddle. Sidewall and bottom surfaces of the cavity are plated with a solder alloy material. A semiconductor die is attached to the bottom surface of the cavity by way of a thermal cycle. A molding compound encapsulates the semiconductor die, a portion of the leads, and a portion of the die paddle.
Claims20
A method comprising:
- forming a package leadframe, the package leadframe including leads and a die paddle;
- forming a cavity in the die paddle;
- plating sidewall and bottom surfaces of the cavity with a solder alloy material;
- attaching a semiconductor die to the bottom surface of the cavity by way of a thermal cycle;
- and
- encapsulating with a molding compound the semiconductor die, a portion of the leads, and a portion of the die paddle.
3 more elements
A semiconductor device comprising:
- a package leadframe having a plurality of conductive leads and a die paddle;
- a cavity formed in the die paddle, the cavity having sidewall and bottom surfaces;
- a solder alloy formed on a portion of the sidewall surfaces and on the bottom surface of the cavity;
- a semiconductor die attached to the bottom surface of the cavity by way of the solder alloy;
- and
- a molding compound encapsulating the semiconductor die, a portion of the conductive leads, and a portion of the die paddle.
3 more elements
A method comprising:
- providing a package leadframe including a plurality of conductive leads and a die paddle, the die paddle having a cavity formed in a top surface;
- plating sidewall and bottom surfaces of the cavity with a solder alloy material;
- attaching a semiconductor die to the bottom surface of the cavity while heating the die paddle to reflow the solder alloy;
- and
- encapsulating with a molding compound the semiconductor die, a portion of the leads, and a portion of the die paddle.
2 more elements
Dependencies are inferred from the claim text.