Leadframe package with adjustable clip

A method of forming an integrated circuit package, comprising:

• providing a leadframe that includes a die pad and a lead having a terminal pad, the die pad having a right side, a left side and a center equidistant from the right side and the left side in a direction parallel with a plane of the top surface of the die pad;
• providing a clip that includes a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip, the clip including a die contact area on the bottom surface of the clip that is proximate to a second end of the clip, the surface pattern including features that extend downward from the bottom surface of the clip, the surface pattern having a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead;
• attaching a semiconductor die to the top surface of the die pad;
• attaching the die contact area of the clip to a top contact on the semiconductor die, wherein the die contact area of the clip is attached to the top contact on the semiconductor die above the top surface of the die pad and between the center and the right side of the top surface of the die pad in a direction perpendicular to a plane of the top surface of the die pad;
• and
• attaching a portion of the surface pattern on the bottom surface of the clip to a top surface of the terminal pad of the lead such that other portions of the surface pattern on the bottom surface of the clip that are not attached to the top surface of the terminal pad are on a right side of the top surface of the terminal pad.

A method of forming an integrated circuit package, comprising:

• providing a leadframe that includes a die pad and a lead having a terminal pad, the die pad having a right side, a left side and a center equidistant from the right side and the left side in a direction parallel with a plane of the top surface of the die pad;
• providing a clip that includes a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip, the clip including a die contact area on the bottom surface of the clip that is proximate to a second end of the clip, the surface pattern including features that extend downward from the bottom surface of the clip, the surface pattern having a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead;
• attaching a semiconductor die to the top surface of the die pad;
• attaching the die contact area of the clip to a top contact on the semiconductor die, wherein the die contact area of the clip is attached to the top contact on the semiconductor die above the top surface of the die pad at approximately the center of the top surface of the die pad in a direction perpendicular to a plane of the top surface of the die pad;
• and
• attaching a portion of the surface pattern on the bottom surface of the clip to a top surface of the terminal pad of the lead such that other portions of the surface pattern on the bottom surface of the clip that are not attached to the top surface of the terminal pad are on a left side of the top surface of the terminal pad.

An apparatus, comprising:

• a leadframe that includes a die pad and a lead, the lead having a terminal pad;
• and
• a clip that includes a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip, the surface pattern configured to be attached to a top surface of the terminal pad, the clip including a die contact area on the bottom surface of the clip that is proximate to a second end of the clip,
• wherein the surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad so that a die selected from a plurality of dies each having a different size in the longitudinal direction of the clip in the direction parallel with the plane of the bottom surface of the die pad can be attached to the die pad with the die contact area of the clip attached to a top contact on the semiconductor die such that a different portion of the surface pattern of the clip is attached to the top surface of the terminal pad of the lead depending on the size of the selected die.