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US 2022/0189849 A1Published application
Electronic package and heat dissipation structure thereof
AssigneeAuras Technology Co., Ltd.
InventorsJian-Dih Jeng, Chien-Yu Chen, Wei-Hao Chen
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Abstract
An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.
Claims23
A heat dissipation structure, comprising:
- a heat dissipation element having a plurality of first bonding pillars and a plurality of second bonding pillars;
- a first metal layer formed on the first bonding pillars and the second bonding pillars;
- and
- a second metal layer formed on the first metal layer.
1 more element
An electronic package, comprising:
- a carrying structure;
- an electronic component mounted on the carrying structure and electrically connected to the carrying structure;
- and
- a heat dissipation structure bonded onto the electronic component via a second metal layer and comprising:
- a heat dissipation element having a plurality of first bonding pillars and a plurality of second bonding pillars;
- a first metal layer formed on the first bonding pillars and the second bonding pillars;
- and
- a second metal layer formed on the first metal layer.
5 more elements
Dependencies are inferred from the claim text.