Back to results
US 2022/0189848 A1Published application
Module with substrate recess for conductive-bonding component
AssigneeSemiconductor Components Industries, LLC
InventorsLeo GU, Sixin JI, Jie CHANG, Keunhyuk LEE, Yong LIU
Life of this patent
Estimating the term…
Abstract
In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.
Claims20
An apparatus, comprising:
- a semiconductor component;
- a substrate including a recess;
- a conductive-bonding component;
- and
- the conductive-bonding component disposed between the semiconductor component and the substrate, the conductive-bonding component having a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between a top of the substrate and the bottom surface of the semiconductor component.
2 more elements
An apparatus, comprising:
- a semiconductor component;
- a substrate including a channel;
- a conductive-bonding component;
- and
- the semiconductor component being coupled to the substrate via the conductive-bonding component, the channel having an inner edge and an outer edge, the inner edge defining a mesa disposed below the semiconductor component.
2 more elements
A method, comprising:
- forming a recess and a mesa in a metal layer associated with a substrate;
- disposing a first portion of a conductive-bonding component on the mesa and a second portion of the conductive-bonding component in the recess;
- and
- disposing a semiconductor component on the conductive-bonding component such that the second portion of the conductive-bonding component is disposed between an edge of the semiconductor component and a bottom surface of the recess.
1 more element
Dependencies are inferred from the claim text.