Semiconductor device and manufacturing method thereof

A semiconductor structure, comprising:

• a circuit substrate;
• a first encapsulated semiconductor die disposed on the circuit substrate;
• and
• a metallic cover disposed over the circuit substrate and covering the first encapsulated semiconductor die, wherein the metallic cover comprises:
• a lid extending horizontally over the first encapsulated semiconductor die and the circuit substrate;
• and
• outer flanges, connected with the lid, extending from the lid towards the circuit substrate, and overlying a periphery of the circuit substrate,
• wherein the lid has hollow grooves concave into the lid with a depth, and the grooves are located outside a span of the first encapsulated semiconductor die, and
• wherein the grooves include a first groove and a second groove extending along different directions, and the first groove and the second groove are intersected.

A manufacturing method of a semiconductor structure, comprising:

• disposing an encapsulated semiconductor die to a circuit substrate, the encapsulated semiconductor die being electrically connected with the circuit substrate;
• disposing a first adhesive along edges of the circuit substrate;
• arranging a metallic cover over the encapsulated semiconductor die and the circuit substrate, wherein the metallic cover comprises a lid, outer flanges connected to edges of the lid and a support;
• applying a first adhesive on the circuit substrate;
• bonding the support on the first adhesive;
• and
• bonding the outer flanges to the support via a second adhesive, so that the lid overlies the encapsulated semiconductor die and the outer flanges extends from the lid towards the support,
• wherein an elastic modulus of the first adhesive is greater than an elastic modulus of the second adhesive.