Semiconductor package comprising heat spreader and manufacturing method thereof
AssigneeOrient Semiconductor Electronics Limited
InventorsYUEH-MING TUNG, CHIA-MING YANG, JUNG-WEI CHEN, JIAN-DE LEU, GUAN-LIN PAN
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Abstract
The present disclosure provides a semiconductor package. The semiconductor package includes a redistribution layer, a die, a heat spreader, a thermal interface material and a molding layer. The die is disposed on the redistribution layer. The heat spreader is disposed on the die. The thermal interface material is applied between the heat spreader and the die. The molding layer is formed on the redistribution layer to enclose the die. The present disclosure further provides a method of manufacturing the above semiconductor package.
Claims11
A semiconductor package, comprising:
- a redistribution layer;
- a die disposed on the redistribution layer;
- a heat spreader disposed on the die;
- a thermal interface material applied between the heat spreader and the die;
- and
- a molding layer formed on the redistribution layer to cover side surfaces of the die.
A method of manufacturing a semiconductor package, comprising:
- providing a redistribution layer having opposing first surface and second surface;
- disposing a die on the first surface of the redistribution layer and electrically connecting the die to the redistribution layer;
- applying a thermal interface material on the die;
- disposing a heat spreader on the die such that the thermal interface material is positioned between the heat spreader and the die;
- and
- forming a molding layer, with a molding material, on the redistribution layer to cover side surfaces of the die.
Dependencies are inferred from the claim text.