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US 2022/0189841 A1Published application
Electro-optical package and method of fabrication
AssigneeRockley Photonics Limited
InventorsShuhe LI, Gerald Cois BYRD
Life of this patent
Estimating the term…
Abstract
An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.
Claims20
An assembly, comprising:
- a carrier;
- a first integrated circuit, on the carrier;
- a first bonding layer, between the carrier and the first integrated circuit;
- a thermoelectric cooler, on the carrier;
- a second integrated circuit, on the thermoelectric cooler;
- and
- a first wire bond, connecting a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit,
- the first pad and the second pad having a height difference less than 100 microns.
5 more elements
A method, comprising:
- bonding a thermoelectric cooler to a carrier;
- placing a first bonding agent and a spacer on the carrier, the first bonding agent being between the spacer and the carrier;
- adjusting the height of a top surface of the spacer to achieve, within 20 microns, a target height relative to a top surface of the thermoelectric cooler;
- and
- causing the first bonding agent to set.
2 more elements
Dependencies are inferred from the claim text.