Inter-component material in microelectronic assemblies having direct bonding

A microelectronic assembly, comprising:

• an interposer having a first face and an opposing second face;
• a first microelectronic component, having a first surface and an opposing second surface, coupled at the first surface to the second face of the interposer by a first direct bonding region;
• a second microelectronic component, having a first surface and an opposing second surface, coupled at the first surface to the second face of the interposer by a second direct bonding region;
• a liner material on the second surface of the interposer and around the first and second microelectronic components;
• a thermally conductive fill material on the liner material and between the first and second microelectronic components;
• and
• a thermally conductive bulk material bonded to the second surfaces of the first and second microelectronic components.

A microelectronic assembly, comprising:

• an interposer;
• a first microelectronic component, having a first surface and an opposing second surface, wherein the first surface of the first microelectronic component is coupled to the interposer by a first direct bonding region;
• a second microelectronic component, having a first surface and an opposing second surface, wherein the first surface of the second microelectronic component is coupled to the interposer by a second direct bonding region;
• a thermally conductive fill material on the surface of the interposer and between the first and second microelectronic components;
• and
• a thermally conductive bulk material bonded to the second surfaces of the first and second microelectronic components.