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US 2022/0189837 A1Published application
Circuit base, and heat dissipation base or electronic device provided with same
AssigneeKYOCERA Corporation
InventorsYuichi ABE, Takeshi MUNEISHI
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Abstract
A circuit base of the present disclosure includes a base made of ceramic, a joint layer located on the base, and a metal layer located on the joint layer. The metal layer contains copper. The joint layer contains aluminum, silicon, and oxygen.
Claims9
A circuit base comprising:
- a base made of ceramic;
- a joint layer located on the base;
- and
- a metal layer located on the joint layer,
- wherein the metal layer comprises copper, and
- the joint layer comprises aluminum, silicon, and oxygen.
3 more elements
Dependencies are inferred from the claim text.