Semiconductor device package with die cavity substrate

A packaged semiconductor device, comprising:

• a substrate having a first package surface and a second package surface opposite the first package surface, and the substrate having a die cavity extending into the first package surface to a depth, and the substrate having a trench spaced from and adjacent the die cavity and extending into the first package surface;
• a semiconductor die having an active surface and a backside surface opposite the active surface, the semiconductor die having bond pads on the active surface, the semiconductor die having a thickness and having the backside surface mounted in the die cavity;
• an optically transmissive window mounted over at least a portion of the active surface of the semiconductor die, the optically transmissive window having an upper surface above the first package surface of the substrate;
• conductors coupling the bond pads on the active surface of the semiconductor die to bond fingers on the first package surface of the substrate, the bond fingers between the trench and the die cavity;
• and
• dielectric material over the conductors, the bond fingers, and the bond pads on the semiconductor die, and over at least a portion of the optically transmissive window, and over the first package surface of the substrate from the semiconductor die to an edge of the trench, the dielectric material having an upper surface that is above the first package surface of the substrate.

An apparatus, comprising:

• a substrate having a first package surface and a second package surface opposite the first package surface, and the substrate having a die cavity extending into the first package surface of the substrate to a depth;
• a semiconductor die comprising a spatial light modulator, the semiconductor die having a thickness, the semiconductor die having an active surface and a backside surface opposite the active surface, the semiconductor die having bond pads on the active surface and having the backside surface mounted in the die cavity;
• an optically transmissive window mounted over at least a portion of the active surface of the semiconductor die, the bond pads exposed from the optically transmissive window;
• bond wires coupling the bond pads to bond fingers on the first package surface of the substrate, the bond fingers spaced from the die cavity;
• and
• dielectric material covering the bond wires, the bond fingers, and the bond pads, the dielectric material having an upper surface that is above the first package surface of the substrate.