Method and system to produce dies for a wafer reconstitution
AssigneesMicledi Microdisplays BV, Imec Vzw
InventorsEric BEYNE, Robert MILLER, Kenneth June REBIBIS, Soeren STEUDEL, Johan VERTOMMEN
Life of this patent
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Abstract
A method is provided to produce dies for a wafer reconstitution. The method comprises steps of inspecting an epitaxial wafer to detect one or more defects, overlaying a dicing scheme on the epitaxial wafer with the detected defects, classifying the dies in the dicing scheme as good dies or bad dies, and dicing the good dies and transferring the good dies onto a carrier wafer or a target wafer to wafer reconstitution.
Claims17
A method to produce dies for a wafer reconstitution, the method comprising:
- inspecting an epitaxial wafer to detect one or more defects;
- overlaying a dicing scheme on the epitaxial wafer with the detected defects;
- classifying the dies in the dicing scheme as good dies or bad dies;
- and
- dicing the epitaxial wafer into dies and transferring the good dies onto a target or a carrier wafer.
A system to produces dies for a wafer reconstitution, the system comprises:
- a processing means;
- wherein the processing means is configured to inspect an epitaxial wafer to detect one or more defects by inspection means;
- wherein the processing means is further configured to overlay a dicing scheme on the measured defects of the epitaxial wafer;
- wherein the processing means is further configured to classify the dies as good dies or bad dies;
- and
- wherein the processing means is further configured to dice the good dies by dicing means.
A reconstituted wafer comprising good dies;
- a target wafer or a carrier wafer;
- wherein the good dies are selected from an epitaxial wafer;
- wherein a plurality of the good dies is fixed or bonded on the target wafer or the carrier wafer.
Dependencies are inferred from the claim text.