Micro-semiconductor chip wetting alignment apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsKyungwook HWANG, Hyunjoon KIM, Joonyong PARK, Seogwoo HONG, Junsik HWANG
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Abstract
A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.
Claims24
A micro-semiconductor chip wet alignment apparatus comprising:
- a semiconductor chip wet supply module configured to supply a plurality of micro-semiconductor chips and a liquid onto a transfer substrate so that the plurality of micro-semiconductor chips are movable along with the liquid on the transfer substrate;
- and
- a chip alignment module comprising an absorber configured to be moved along a surface of the transfer substrate and absorb the liquid so that the plurality of micro-semiconductor chips are aligned in a plurality of grooves of the transfer substrate.
A micro-semiconductor chip alignment apparatus comprising:
- a controller;
- and
- an aligner including a supporting plate and an absorber coupled to the supporting plate,
- wherein the controller is configured to control the aligner to move the absorber along a surface of a transfer substrate provided with a plurality of micro-semiconductor chips and a liquid, and
- wherein the absorber is configured to absorb the liquid and align the plurality of micro-semiconductor chips into a plurality of grooves in the transfer substrate.
Dependencies are inferred from the claim text.