Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium

A method of manufacturing a semiconductor device, the method comprising:

• by using a substrate processing apparatus including
• a plurality of process chambers configured to process a substrate,
• a plurality of standby chambers configured to accommodate the substrate,
• a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers,
• a transfer robot provided in the transfer chamber and configured to transfer a substrate, and
• a temperature adjustment mechanism configured to adjust temperature of at least one of the plurality of standby chambers,
• transferring the substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber by the transfer robot;
• and
• performing processing of changing a mode of temperature adjustment on the substrate loaded into the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.

A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process, the substrate processing apparatus including

• a plurality of process chambers configured to process a substrate,
• a plurality of standby chambers configured to accommodate the substrate,
• a transfer chamber disposed adjacent to the plurality of standby chambers and the plurality of process chambers,
• a transfer robot provided in the transfer chamber and configured to transfer the substrate, and
• a temperature adjustment mechanism configured to adjust temperature of at least one of the plurality of standby chambers,
• the process comprising:
• transferring the substrate between one of the plurality of process chambers and one of the plurality of standby chambers or between the plurality of standby chambers adjacent to each other across the transfer chamber by the transfer robot;
• and
• performing processing of changing a mode of temperature adjustment on the substrate loaded into the at least one of the plurality of standby chambers depending on a transfer path through which the substrate accommodated in the at least one of the plurality of standby chambers passes.