US 2022/0189790 A1 · METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

Abstract

A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

Claims15

Dependent claims

A method, comprising:

placing on a pliable mating surface on a major surface of a mold an electronic device comprising an arrangement of contact pads such that at least one contact pad in the arrangement of contact pads presses against the pliable mating surface, wherein the pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold;
applying a liquid encapsulant material over the electronic device and the major surface of the mold;
hardening the liquid encapsulant material to form a carrier for the electronic device;
separating the mold from the carrier such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, wherein the at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels;
depositing a conductive particle-containing liquid in the microchannel, such that the conductive particle-containing liquid directly contacts the contact pad exposed in the microchannel.

2 more elements

A method, comprising:

placing on a major surface of a mold an electronic device comprising an arrangement of electrically conductive contact pads such that at least one contact pad in the arrangement of contact pads presses against a pliable mating surface on at least one ridge in an arrangement of ridges extending upward from the major surface of the mold;
applying a liquid encapsulant material to cover the electronic device and occupy regions between the electronic device and the mold;
hardening the liquid encapsulant material to form a carrier for the electronic device;
removing the mold from the carrier, wherein a major surface of the carrier comprises an arrangement of channels corresponding to the arrangement of ridges in the mold, and wherein the at least one contact pad is exposed in the channel to form an electrical contact site in an interconnect channel;
inverting the carrier of the electronic device;
and
depositing a conductive particle-containing liquid in the interconnect channel, primarily by capillary pressure, such that the conductive particle-containing liquid directly contacts the electrical contact site.

4 more elements

Dependencies are inferred from the claim text.

Methods for registration of circuit dies and electrical interconnects

Life of this patent

Methods for registration of circuit dies and electrical interconnects

Life of this patent

Abstract

Claims15