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US 2022/0189784 A1Published application
Deflectable platens and associated methods
AssigneeApplied Materials, Inc.
InventorsMing Yin, Dawei Sun
Life of this patent
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Abstract
A deflectable platen including a first layer formed of a material having a first coefficient of thermal expansion (CTE), and a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE.
Claims18
A method of deflecting a platen comprising:
- providing a first layer formed of a material having a first coefficient of thermal expansion (CTE);
- providing a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE;
- and
- heating the first and second layers to a temperature in a range of 200 degrees Celsius to 600 degrees Celsius.
1 more element
A method of deflecting a platen comprising:
- providing a first layer formed of a material having a first coefficient of thermal expansion (CTE);
- providing a second layer bonded to the first layer and having a second CTE, the second layer including a plurality of electrodes embedded therein for facilitating electrostatic clamping of wafers to the second layer, wherein the second CTE is different than the first CTE;
- and
- cooling the first and second layers to a temperature in a range of −50 degrees Celsius to −150 degrees Celsius.
1 more element
Dependencies are inferred from the claim text.