Back to results
US 2022/0189750 A1Published application
Sputtering Target And Method For Manufacturing Sputtering Target
AssigneeJX Nippon Mining & Metals Corporation
InventorYuki Furuya
Life of this patent
Estimating the term…
Abstract
Provided is a sputtering target capable of reducing generation of particles, and a method for producing the same. The sputtering target includes: 10 mol % or more and 85 mol % or less of Co, 0 mol % or more and 47 mol % or less of Pt, and 0 mol % or more and 47 mol % or less of Cr, as metal components; and at least B6O as an oxide component.
Claims18
A sputtering target comprising:
- 10 mol % or more and 85 mol % or less of Co, 0 mol % or more and 47 mol % or less of Pt, and 0 mol % or more and 47 mol % or less of Cr, as metal components;
- and
- at least B6O as an oxide component.
A method for producing a sputtering target comprising:
- preparing 10 mol % or more and 85 mol % or less of Co, 0 mol % or more and 47 mol % or less of Pt, and 0 mol % or more and 47 mol % or less of Cr as metal powder;
- adding B6O in the form of oxide powder to the metal powder to mix them;
- and
- sintering the mixed powder.
1 more element
Dependencies are inferred from the claim text.