Process Kit Conditioning Chamber

An ex situ physical vapor deposition (PVD) process kit conditioning apparatus configured to condition process kit components of a PVD substrate processing chamber, the ex situ PVD process kit conditioning apparatus comprising:

• a chamber assembly comprising a chamber floor, a chamber housing and a chamber upper plate, the chamber upper plate having one or more openings configured to expose one or more targets, the conditioning apparatus configured to deposit a defect reduction coating, the chamber housing and chamber upper plate defining a conditioning volume configured to receive process kit components from the PVD substrate processing chamber;
• and
• a central cathode assembly configured to mount the one or more targets, wherein upon positioning of the process kit components within the conditioning volume of the ex situ PVD process kit conditioning apparatus, the central cathode assembly is positioned and configured so that apparatus deposit the defect reduction coating substantially uniformly on an inner surface of the process kit components of the PVD substrate processing chamber, at least one of the process kit components having a sloped wall and a concave inner surface.