Workpiece Processing Apparatus with Plasma and Thermal Processing Systems

A processing apparatus for processing a workpiece, the workpiece having a top side and a back side opposite from the top side, the processing apparatus comprising:

• a processing chamber;
• a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber;
• a gas delivery system configured to deliver one or more process gases to the plasma chamber;
• a plasma source configured to generate a plasma from the one or more process gases in the plasma chamber;
• a workpiece support disposed within the processing chamber, the workpiece support configured to support a workpiece, the workpiece support comprising quartz, wherein the back side of the workpiece faces the workpiece support;
• one or more radiative heating sources configured on a second and opposite side of the first side of the processing chamber, the one or more radiative heating sources configured to heat the workpiece from the back side of the workpiece;
• a dielectric window disposed between the workpiece support and the one or more radiative heating sources;
• a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a temperature measurement indicative of a temperature of the back side of the workpiece;
• and
• a workpiece temperature control system configured to control power supply to the radiative heating sources.