Semiconductor processing equipment including electrostatic chuck for plasma processing

An electrostatic chuck comprising:

• a side area disposed outside a step formed at an outer perimeter portion;
• and
• a processing area disposed inside the step while having a greater height than the side area, wherein:
• an upper surface of the processing area has a tilt of 0.01 or less, and
• electric field vectors in different directions are generated in the processing area.

Semiconductor processing equipment comprising:

• a chamber;
• an upper electrode disposed at a top portion of the chamber;
• a gas supplier connected to the upper electrode at an outside of the chamber;
• a substrate supporting structure spaced apart from the upper electrode in the chamber to define a processing volume, the substrate supporting structure supporting a substrate;
• a vertical rod disposed at a lower side of the substrate supporting structure, the vertical rod extending through a bottom portion of the chamber;
• a focus ring disposed at an edge of the substrate supporting structure;
• an upper edge ring disposed at an outer edge of the focus ring;
• an isolator providing an electrical signal to the substrate supporting structure;
• a lower edge ring disposed at a side of the isolator and a lower side of the upper edge ring;
• and
• a ground plate connected to the isolator, wherein:
• the substrate supporting structure includes:
• a lower electrode comprising a side area disposed outside a step formed at an outer perimeter portion of the lower electrode, and a processing area disposed inside the step;
• a first plate disposed on the lower electrode;
• an attraction electrode disposed on the first plate;
• and
• a second plate disposed on the attraction electrode, the second plate supporting the substrate in a state in which the substrate is laid on an upper surface of the second plate,
• each of the first plate and the second plate comprises ceramic, and
• the lower electrode has a maximum height at a central portion of the processing area.