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US 2022/0189741 A1Published application
Methods and systems for depositing a layer
AssigneeASM IP Holding B.V.
InventorsDaniele Piumi, Pamela Fischer
Life of this patent
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Abstract
Plasma-assisted methods for depositing materials and related systems are described. The methods described herein comprise ending a deposition process when a plasma characteristic matches a pre-determined criterion.
Claims19
A method for depositing a layer on a substrate, the method comprising the steps:
- providing a system comprising
- a reaction chamber, the reaction chamber comprising a substrate support and an upper electrode, the substrate support comprising a lower electrode;
- a radio frequency power source arranged for generating a radio frequency power waveform;
- positioning a substrate on the substrate support;
- executing a deposition process, the deposition process comprising
- providing one or more gaseous precursors to the reaction chamber;
- generating a plasma in the reaction chamber by means of the radio frequency power waveform;
- and,
- monitoring a monitored plasma characteristic;
- wherein the deposition process is ended when the monitored plasma characteristic matches a pre-determined criterion.
7 more elements
A system comprising:
- a reaction chamber, the reaction chamber comprising a substrate support and an upper electrode, the substrate support comprising a lower electrode;
- a radio frequency power source arranged for generating a radio frequency power waveform;
- a gas injection system fluidly coupled to the reaction chamber;
- at least one gas source for introducing a precursor and optionally a carrier gas in the reaction chamber;
- an exhaust;
- and
- a controller comprising
- a gas flow controlling unit arranged to control gas flow into the gas injection system,
- a memory arranged to store a pre-determined plasma characteristic;
- a plasma control and measurement unit, the plasma control and measurement unit being arranged for causing the system to generate a radio frequency plasma in the reaction chamber by means of the radio frequency power waveform, and the plasma control and measurement unit being further arranged to monitor the radio frequency plasma, thereby obtaining a monitored plasma characteristic;
- a comparing unit arranged to compare the monitored plasma characteristic with the pre-determined plasma characteristic stored in the memory;
- the controller being configured to end a deposition process when the comparing unit indicates that the monitored plasma characteristic matches a pre-determined criterion.
9 more elements
Dependencies are inferred from the claim text.