Workpiece Processing Apparatus with Plasma and Thermal Processing Systems

A processing apparatus for processing a workpiece, the processing apparatus comprising:

• a processing chamber;
• a plasma chamber separated from the processing chamber, the plasma chamber disposed on a first side of the processing chamber;
• a gas supply system configured to deliver one or more process gases to the plasma chamber;
• a plasma source configured to generate a plasma from the one or more process gases in the plasma chamber;
• a workpiece support disposed within the processing chamber, the workpiece support configured to support a workpiece, wherein a back side of the workpiece faces the workpiece support;
• one or more radiative heat sources configured on a second and opposite side of the first side of the processing chamber, the radiative heating sources configured to heat the workpiece from the back side of the workpiece;
• a dielectric window disposed between the workpiece support and the one or more radiative heat sources;
• and
• a rotation system configured to rotate the workpiece, the rotation system comprising a magnetic actuator.