Integrated circuit, wireless communication card and wiring structure of identification mark
AssigneeAu Optronics Corporation
InventorsShyh-Bin Kuo, Hsiang-Chi Cheng, Sin-Jie Wang, Yi-Cheng Lai, Chung-Hung Chen, Shih-Hsing Hung
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Abstract
An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.
Claims20
An integrated circuit, comprising:
- a power supply wiring;
- a ground wiring;
- at least one identification mark pattern respectively having a first conductive wiring and a second conductive wiring overlapping each other, wherein the first conductive wiring is electrically connected to the power supply wiring, and the second conductive wiring is electrically connected to the ground wiring,
- wherein the at least one identification mark pattern is identified by one of hollow portion and contour of the first conductive wiring of the at least one identification mark pattern, and the second conductive wiring of the at least one identification mark pattern is disposed between the first conductive wiring of the at least one identification mark pattern and a substrate.
A wiring structure of an identification mark, comprising:
- a first wiring;
- a second wiring;
- at least one identification mark pattern respectively having a first conductive wiring and a second conductive wiring overlapping each other, wherein the first conductive wiring is electrically connected to the first wiring, and the second conductive wiring is electrically connected to the second wiring,
- wherein the at least one identification mark pattern is identified by one of hollow portion and contour of the first conductive wiring of the at least one identification mark pattern, and the second conductive wiring of the at least one identification mark pattern is disposed between the first conductive wiring of the at least one identification mark pattern and a substrate.
Dependencies are inferred from the claim text.