Faraday rotator interconnect as a through-via configuration in a patch architecture
AssigneeIntel Corporation
InventorsBrandon C. MARIN, Divya PRATAP, Hiroki TANAKA, Nitin DESHPANDE, Omkar KARHADE, Robert Alan MAY, Sri Ranga Sai BOYAPATI, Srinivas V. PIETAMBARAM, Xiaoqian LI, Sai VADLAMANI, Jeremy ECTON
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