Improvements in or relating to photonic integrated circuits
AssigneeAdvanced Micro Foundry Pte. Ltd.
InventorsChao LI, Guo-Qiang LO
Life of this patent
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Abstract
The present invention relates of a photonic integrated and a method of fabricating a photonic integrated chip, PIC, configured for alignment and attachment of a laser diode in a predetermined position in which light from the laser diode is aligned with an input of the PIC; wherein the photonic chip comprises an asymmetric alignment assembly for receiving and aligning the laser diode in the predetermined position; and wherein the input comprises a coupler for receiving a laser beam from the laser diode in use.
Claims19
-40. (canceled)
A photonic integrated chip, PIC, configured for alignment and attachment of a laser diode in a predetermined position in which light from the laser diode is aligned with an input of the PIC;
- wherein the photonic chip comprises an asymmetric alignment arrangement for receiving and aligning the laser diode in the predetermined position;
- and
- wherein the input comprises a coupler for receiving a laser beam from the laser diode in use.
A method of fabricating a photonic integrated chip, PIC, adapted to receive a laser diode in a predetermined position, the method comprising:
- forming from a first material a substrate, the substrate comprising an asymmetric alignment arrangement defining the predetermined position;
- forming from at least one second material a chip for a function and having a coupler for receiving a laser beam in use.
Dependencies are inferred from the claim text.