Solder reflow compatible connections between optical components
AssigneeCisco Technology, Inc.
InventorsMatthew J. TRAVERSO, Jock T. BOVINGTON, Ashley J.M. ERICKSON
Life of this patent
Estimating the term…
Abstract
Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.
Claims20
A device, comprising:
- a first optical component that includes a first optical channel defined at a first height relative to a reference plane and that terminates at a first interface surface of the first optical component;
- and
- a second optical component that includes a second optical channel defined at a second height, different from the first height, relative to the reference plane and that terminates at a second interface surface of the second optical component;
- wherein an air gap is defined between the first interface surface and the second interface surface;
- wherein a light path is defined between the first optical channel and the second optical channel across at least a portion of the air gap;
- and
- wherein the first optical component is bonded, via a solder bond, to the second optical component.
A device, comprising:
- a first optical component that includes a first optical channel;
- and
- a second optical component that includes a second optical channel aligned with the first optical channel to define a light path running between the first optical component and the second optical component, wherein an air gap is defined between the first optical component and the second optical component through which the light path travels;
- and
- an epoxy that bonds the first optical component with the second optical component, and wherein the epoxy is reflow compatible to remain stable and bond the first optical component with the second optical component at temperatures of at least 260 degrees Celsius for at least five minutes.
A method, comprising:
- positioning a first optical component relative to a second optical component to define an air gap between a first optical channel included in the first optical component and a second optical channel included in the second optical component;
- and
- applying a reflow compatible epoxy in at least a portion of the air gap between the first optical channel and the second optical channel, wherein the reflow compatible epoxy is configured to remain bonded between the first optical component and the second optical component at temperatures of at least 260 degrees Celsius.
Dependencies are inferred from the claim text.