Active thermal interposer device

A testing device for testing a system-in-package device under test (DUT), said device comprising:

• stand-alone active thermal interposer device for use in testing said DUT and for coupling with a thermal controller, said active thermal interposer device comprising:
• a body layer having a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate;
• and
• a plurality of heating zones defined across a second surface of said body layer, said plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when said second surface of said body layer is disposed adjacent to an interface surface of said DUT during testing of said DUT;
• and
• a thermal head for coupling to the thermal controller and operable to interface with said active thermal interposer device during testing of said DUT, said thermal head comprising:
• said cold plate;
• and
• an insulation cover for insulating said cold plate, wherein said insulation cover comprises an injection port for reducing condensation from said cold plate.

A testing arrangement for testing a system-in-package device under test (DUT), said arrangement comprising:

• a socket device for containing said DUT and for interfacing with a loadboard;
• stand-alone active thermal interposer device for use in testing said DUT, said active thermal interposer device comprising:
• a body layer having a first surface and the second surface, wherein said first surface is operable to be disposed adjacent to a cold plate;
• and
• a plurality of heating zones defined across a second surface of said body layer, said plurality of heating zones operable to be controlled to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when said active thermal interposer device is inserted into said socket and said second surface of said body layer is disposed adjacent to an interface surface of said DUT;
• a thermal head operable to interface with said active thermal interposer device during testing of said DUT, said thermal head comprising said cold plate;
• and
• a thermal controller for coupling with said thermal interposer to control said plurality of heating zones and to control said cold plate, said thermal controller comprising firmware operable to perform thermal regulation during testing of said DUT, said firmware operable to:
• obtain first temperatures which are of said cold plate from a temperature sensor of said cold plate;
• obtain second temperatures of the bottom surface of the active thermal interposer device for each heating zone thereof using respective resistance temperature detectors;
• obtain third temperatures of each area of the DUT provided the DUT is active and circuitry on the loadboard is operable to collect a junction temperature for each area of the DUT;
• based on the first temperatures, perform an outer slower loop to regulate a fan speed (for air control) or a fluid regulation valve (for liquid/refrigerant control) of the cold plate;
• and
• based on the second and third temperatures, perform an inner faster loop to regulate heater control/Peltier control of the plurality of heating zones of the active thermal interposer device.