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US 2022/0187342 A1Published application
Microelectronic test interface substrates, devices, and methods of manufacture thereof vertical and horizontal electrical shield on inner layer connecting conductor vias and conductor traces of any positions on buildup redistribution layer system
OwnerRaymond Won Baeinventor
Life of this patent
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Abstract
An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising and providing a base substrate; buildup layer level thereof vertical and/or horizontal electrical shield on Inner layer connecting conductor vias and traces in any positions in the buildup redistribution system.
Claims22
Microelectronic buildup redistribution layer system comprising;
- A, a substrate comprising base carrier, dielectric, conductor traces, conductor vias connecting layers. B, a microelectronic redistribution layers include a buildup process on base carrier. C, a microelectronic redistribution layers included the different or same layers.
A method of manufacturing microelectronic buildup redistribution layer system comprising and providing;
- A, a substrate forming a plurality of microelectronic redistribution layers on the substrate, the redistributions layers including a dielectric layer and conductive (conductor) traces. B, a substrate forming a multi-layer structure by cross-linking or connecting layers by via conductor.
Dependencies are inferred from the claim text.