Microelectronic test interface substrates, devices, and methods of manufacture thereof layer level test and repair on buildup redistribution layers
OwnerRaymond Won Baeinventor
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Abstract
An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising: providing a substrate; patterning a first layer of a routing trace over the base substrate; testing the first layer of the routing traces; repair of any defect traces; re-patterning of defect traces; testing the first layer of routing traces for validation of the 1st layer routing traces; repeating the 2nd layer to each consequent buildup layers as the 1st layer patterning of a routing traces, testing of a routing traces, re-patterning of defect traces and testing of layer routing traces for validation.
Claims22
Microelectronic buildup redistribution layer system comprising:
- A, a substrate comprising base carrier, dielectric, conductor traces, conductor vias connecting layers. B, a microelectronic redistribution layers include a buildup process on base carrier. C, a microelectronic redistribution layers included the different or same layers.
A method of manufacturing microelectronic buildup redistribution layer system comprising and providing a substrate forming a plurality of microelectronic redistribution layers on the substrate, the redistributions layers including a dielectric layer and conductive (conductor) traces and forming a multi-layer structure by cross-linking or connecting layers by via conductor.
Dependencies are inferred from the claim text.