Detection mechanism, wire positioning apparatus, and wire processing device

A conducting wire positioning apparatus for a conducting wire processing device, the conducting wire positioning apparatus comprising a pushing mechanism and a detection mechanism for detecting an exposed conductor portion of a conducting wire, the detection mechanism comprising:

• an electrically conductive assembly, comprising at least two electrically conductive probes;
• wherein, the at least two electrically conductive probes are spaced and are configured to be in electric connection with the exposed conductor portion by contacting with the exposed conductor portion;
• a displacement assembly, configured to drive the electrically conductive assembly to switch between a separated position and a contact position;
• wherein a moving path of the electrically conductive assembly is a straight line;
• when the electrically conductive assembly is located at the contact position, the at least two electrically conductive probes are in contact with the conducting wire;
• when the electrically conductive assembly is at a separated position, the at least two electrically conductive probes are separated from the conducting wire;
• and
• a detection circuit, being in electric connection with the at least two electrically conductive probes;
• wherein when the electrically conductive assembly is located at the contact position, the detection circuit is configured to detect and determine whether the exposed conductor portion of the conducting wire is located at a designated position;
• wherein, when the at least two electrically conductive probes are all in electric connection with the exposed conductor portion of the conducting wire, the detection circuit is turned on, and it is determined that the exposed conductor portion is located at the designated position;
• wherein, when less than two electrically conductive probes are in electric connection with the exposed conductor portion of the conducting wire, it is determined that the exposed conductor portion is not located at the designated location;
• and
• wherein the pushing mechanism is configured to push a heat-shrinkable sleeve sleeved outside the conducting wire to a preset position.

A conducting wire processing device, comprising:

• a main body,
• a heating apparatus, and
• a conducting wire positioning apparatus for a conducting wire processing device, the conducting wire positioning apparatus comprising a pushing mechanism and a detection mechanism for detecting an exposed conductor portion of a conducting wire,
• wherein the detection mechanism comprises:
• an electrically conductive assembly, comprising at least two electrically conductive probes;
• wherein, the at least two electrically conductive probes are spaced and are configured to be in electric connection with the exposed conductor portion by contacting with the exposed conductor portion;
• a displacement assembly, configured to drive the electrically conductive assembly to switch between a separated position and a contact position;
• wherein a moving path of the electrically conductive assembly is a straight line;
• when the electrically conductive assembly is located at the contact position, the at least two electrically conductive probes are in contact with the conducting wire;
• when the electrically conductive assembly is at a separated position, the at least two electrically conductive probes are separated from the conducting wire;
• and
• a detection circuit, being in electric connection with the at least two electrically conductive probes;
• wherein when the electrically conductive assembly is located at the contact position, the detection circuit is configured to detect and determine whether the exposed conductor portion of the conducting wire is located at a designated position;
• wherein, when the at least two electrically conductive probes are all in electric connection with the exposed conductor portion of the conducting wire, the detection circuit is turned on, and it is determined that the exposed conductor portion is located at the designated position;
• wherein, when less than two electrically conductive probes are in electric connection with the exposed conductor portion of the conducting wire, it is determined that the exposed conductor portion is not located at the designated location;
• wherein the pushing mechanism is configured to push a heat-shrinkable sleeve sleeved outside the conducting wire to a preset position;
• wherein the main body is configured to support the heating apparatus and the conducting wire positioning apparatus for a conducting wire processing device;
• and
• wherein the heating apparatus is configured to heat the heat-shrinkable sleeve to enable the heat-shrinkable sleeve to be fixedly connected to the conducting wire.