Method and apparatus for monitoring edge bevel removal area in semiconductor apparatus and electroplating system

An electroplating system, comprising:

• an electroplating apparatus, arranged to electroplate a wafer;
• and
• a semiconductor apparatus, comprising:
• a transfer chamber, arranged to interface with the electroplating apparatus;
• an annealing station, arranged to anneal the wafer;
• a robot arm, arranged to transfer the wafer from the transfer chamber to the annealing station;
• an edge detector, disposed between the transfer chamber and the annealing station for monitoring at least one portion of an edge bevel removal area of the wafer when the robot arm is transferring the wafer from the transfer chamber to the annealing station, wherein the at least one portion of the edge bevel removal area comprises a first portion and a second portion different from the first portion, and the edge detector comprises:
• a first charge-coupled device (CCD) sensor, arranged to capture an image of the first portion of the edge bevel removal area;
• and
• a second CCD sensor, arranged to capture an image of the second portion of the edge bevel removal area;
• and
• a trigger device configured to, when the first portion and the second portion of the edge bevel removal area are passing through a first location and a second location between the transfer chamber and the annealing station, respectively, activate the first CCD sensor and the second CCD sensor to capture the image of the first portion and the image of the second portion, respectively.

A semiconductor apparatus, comprising:

• an annealing station, arranged to anneal a wafer;
• a robot arm, arranged to transfer the wafer to the annealing station from a transfer chamber;
• a charge-coupled device (CCD) camera, disposed over a predetermined location between the transfer chamber and the annealing station, for capturing at least one image of an edge bevel removal area of the wafer when the robot arm is carrying the wafer to pass through the predetermined location, wherein the CCD camera comprises:
• N CCD sensors, arranged to capture images of N different portions of the edge bevel removal area, respectively, when the robot arm is carrying the wafer to pass through the predetermined location, wherein N is a positive integer greater than one;
• the N CCD sensors are disposed over N positions respectively;
• when the robot arm is carrying the wafer to pass through the predetermined location, the N different portions of the edge bevel removal area are passing through the N positions, respectively;
• and
• a trigger device configured to, when the robot arm is carrying the water to pass through the predetermined location, activate the N CCD sensors to capture the images of the N different portions of the edge bevel removal area of the wafer, respectively.