Optical package of an integrated circuit

A method for manufacturing an optical package which includes an electronic integrated circuit chip supporting an optical device and electric connection zones, comprising:

• forming a thermally degradable protective layer covering the optical device;
• forming an insulating coating that coats the electronic integrated circuit chip while covering said electric connection zones but not covering said thermally degradable protective layer;
• applying a thermal treatment to degrade the thermally degradable protective layer and expose the optical device;
• creating via openings passing through the insulating coating from a first face to a second face opposite to the first face;
• creating first patterns arranged on the first face of the insulating coating and extending from the via openings to the electric connection zones;
• creating second patterns on the second face of the insulting coating extending from said via openings;
• forming electrically conductive paths in the via openings;
• forming electrically conductive tracks in the first and second patterns;
• wherein the electrically conductive tracks electrically connect the electrically conductive paths to the electric connection zones of the electronic integrated circuit chip at the first face of the insulating coating and form protruding structures at the second face of the insulating coating;
• and
• fastening an optical plugging element at least partly onto the first face of the insulating coating in a position supporting an optical coupling between the optical plugging element and the optical device.