Flexible vapor chamber with shape memory material
AssigneeIntel Corporation
InventorsJeff Ku, Mark J. Gallina, Min Suet Lim, Jianfang Zhu
Life of this patent
Estimating the term…
Abstract
Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
Claims20
An electronic device comprising:
- one or more heat sources;
- a flexible vapor chamber over the one or more heat sources;
- shape memory material, wherein when the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber from a first position to a second position, wherein the second position dissipates more heat collected by the flexible vapor chamber than the first position;
- and
- an activator, wherein the activator activates the shape memory material.
A flexible vapor chamber with shape memory material comprising:
- the flexible vapor chamber;
- and
- shape memory material, wherein when the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber.
A method for increasing a cooling capacity of a flexible vapor chamber in an electronic device, the method comprising:
- determining that the cooling capacity of the flexible vapor chamber can be increased;
- and
- activating shape memory material to move a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
Dependencies are inferred from the claim text.