Method of plating, apparatus for plating, and non-volatile storage medium that stores program

An apparatus for plating, comprising:

• a plating module configured to perform plating with regard to a substrate;
• and
• a controller configured to control plating in the plating module,
• wherein the controller is configured:
• to respectively supply electric current of a first plating current density and electric current of a second plating current density to a first face and to a second face of the substrate, so as to form a plating film on the first face and a plating film on the second face;
• and
• after plating is completed first either on the first face or on the second face, to supply protection current to the face where plating is completed first, wherein the protection current has a smaller current density than the first plating current density or the second plating current density of the electric current supplied to the face where plating is completed first during plating.

A non-volatile storage medium that stores a program for activating a computer to perform a control method of an apparatus for plating, wherein

• the program comprises:
• respectively supplying electric current of a first plating current density and electric current of a second plating current density to a first face and to a second face of a substrate, so as to form a plating film on the first face and a plating film on the second face;
• and
• after plating is completed first either on the first face or on the second face, supplying protection current to the face where plating is completed first, wherein the protection current has a smaller current density than the first plating current density or the second plating current density of the electric current supplied to the face where plating is completed first during plating.