Method for recording a state of a cvd reactor under production conditions
AssigneeAixtron SE
InventorsPascal TILLMANNS, Oliver SCHÖN, Thomas SCHMITT, Peter Sebald LAUFFER
Life of this patent
Estimating the term…
Loading patent…
AssigneeAixtron SE
InventorsPascal TILLMANNS, Oliver SCHÖN, Thomas SCHMITT, Peter Sebald LAUFFER
Estimating the term…
During a process involving one or more process steps of a process phase, in which a substrate is located in the process chamber of a CVD reactor, a process temperature and a pressure are each set and a process gas flow is fed into the process chamber by way of control data delivered by a controller in accordance with a formula stored in the controller. Additionally, sensors are used to determine measurement data from which a current fingerprint is calculated and then compared with a historic fingerprint. The fingerprint includes only values or groups of values that are obtained from measured values that are recorded during one or more conditioning steps of a conditioning phase in which a conditioning temperature and a conditioning pressure are each set and a conditioning gas flow is fed into the process chamber in accordance with control data specified by the formula.
A method for operating a chemical vapor deposition (CVD) reactor (1) having a process chamber (3), the method comprising:
A device with a chemical vapor deposition (CVD) reactor (1), and a controller (10) storing a formula that causes the controller (10) to:
A method for determining a plurality of values for a plurality of parameters for controlling a temperature of a surface of a substrate (2) supported by a susceptor (4) of a chemical vapor deposition (CVD) reactor (1) to a prescribed substrate temperature, in order to thermally treat the substrate (2) at the prescribed substrate temperature in at least one process step (R1) of a process phase (PR), wherein the plurality of parameters includes a first parameter (TS, LS) that is a heat input parameter, which affects a first heat flux (H1, H2) supplied from a heat source (6) to the susceptor (4), and a second parameter (TS, QC) that is a heat release parameter, which affects a second heat flux (H3, H4) dissipated from the surface of the substrate (2) to a heat sink (22), the method comprising:
(canceled)
Dependencies are inferred from the claim text.