Substrate processing device
AssigneeJusung Engineering Co., Ltd.
InventorsJongSik KIM, ChulJoo HWANG
Life of this patent
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Abstract
The present disclosure relates to an apparatus for processing substrate including a supporting unit for supporting a substrate, a lid disposed apart from the supporting unit in an upward direction, a first gas injection unit coupled to the lid to inject a first gas into a first region, a second gas injection unit coupled to the lid to inject a second gas into a second region, a purge gas unit coupled to the lid to inject a purge gas into a third region disposed between the first region and the second region, and a rotation unit for rotating the supporting unit.
Claims16
An apparatus for processing substrate, the apparatus comprising:
- a supporting unit for supporting a substrate;
- a lid disposed apart from the supporting unit in an upward direction;
- a first gas injection unit coupled to the lid to inject a first gas into a first region;
- a second gas injection unit coupled to the lid to inject a second gas into a second region;
- a purge gas unit coupled to the lid to inject a purge gas into a third region disposed between the first region and the second region;
- and
- a rotation unit for rotating the supporting unit,
- wherein
- the rotation unit rotates the supporting unit, so that the substrate is moved between the first region and the second region, and stops the rotation of the supporting unit while a processing using the first gas is being performed in the first region and a processing using the second gas is being performed in the second region, and
- a distance by which a bottom surface of the first gas injection unit is disposed apart from the supporting unit is shorter than a distance by which a bottom surface of the second gas injection unit is apart from the supporting unit.
Dependencies are inferred from the claim text.