Substrate processing apparatus, method for manufacturing semiconductor device and vaporizer
AssigneeHitachi Kokusai Electric Inc.
InventorsAtsushi MORIKAWA, Masakazu SHIMADA, Takeshi KASAI, Kenichi SUZAKI, Hirohisa YAMAZAKI, Yoshimasa NAGATOMI
Life of this patent
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Abstract
A vaporization system includes a vaporization chamber having a first portion and a second portion. A first fluid supply part is connected to the first portion of the vaporization chamber, and configured to supply a mixed fluid in which a first carrier gas and a liquid precursor are mixed, toward the second portion. A second fluid supply part is configured to supply a second carrier gas toward the mixed fluid at the second portion.
Claims10
A vaporizer comprising:
- a vaporization chamber having a first portion and a second portion;
- a first fluid supply part connected to the first portion of the vaporization chamber, and configured to supply a mixed fluid in which a first carrier gas and a liquid precursor are mixed, toward the second portion;
- and
- a second fluid supply part configured to supply a second carrier gas toward the mixed fluid at the second portion.
A substrate processing apparatus comprising:
- a process chamber configured to accommodate a substrate, and
- a precursor gas supply system configured to supply a vaporized gas obtained by vaporizing a liquid precursor by a vaporizer, as a precursor gas, to the process chamber, the vaporizer including:
- a vaporization chamber having a first portion and a second portion;
- a first fluid supply part connected to the first portion of the vaporization chamber, and configured to supply a mixed fluid in which a first carrier gas and the liquid precursor are mixed, toward the second portion;
- and
- a second fluid supply part configured to supply a second carrier gas toward the mixed fluid at the second portion.
A method for manufacturing a semiconductor device by using a vaporizer comprising:
- a vaporization chamber having a first portion and a second portion;
- a first fluid supply part connected to the first portion of the vaporization chamber, and configured to supply a mixed fluid in which a first carrier gas and a liquid precursor are mixed, toward the second portion;
- and
- a second fluid supply part configured to supply a second carrier gas toward the mixed fluid at the second portion and supply the second carrier gas to a center portion of the second portion from a peripheral portion of the second portion,
- the method comprising:
- supplying a vaporized gas obtained by vaporizing the liquid precursor by the vaporizer, as a precursor gas, to a process chamber that accommodates a substrate;
- removing the precursor gas from the process chamber;
- supplying a reaction gas to the process chamber from which the precursor gas is removed;
- and
- removing the reaction gas from the process chamber.
Dependencies are inferred from the claim text.