In-mold Electronic Structure Using Plating Process and Method Therefor
AssigneeIntops Co., Ltd.
InventorsTae yong HONG, Jun young AHN
Life of this patent
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Abstract
An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.
Claims10
An in-mold electronic structure comprising:
- a film with a design;
- a first plastic resin disposed under the film, and
- a second plastic resin disposed under the first plastic resin,
- wherein an electronic circuit is formed on a top side or both sides of the second plastic resin,
- wherein an electronic device is mounted on the top side or the both sides of the second plastic resin,
- wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.
A method of an in-mold electronic structure comprising a film with a design, a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, manufacturing the film comprises:
- manufacturing a material layer with elastic plastic resin;
- forming a design on the material layer using one of methods:
- printing using one of silk screen, pad printing, ink jet printing, offset printing, or digital printing;
- deposition, or
- UV molding,
- manufacturing a three dimensional shape by performing a forming process on the material layer with the design, the forming process one of heat forming, vacuum forming, or high pressure forming, and
- cutting the material layer in the three dimensional shape to fit on a size of a product and completing the film.
A method of an in-mold electronic structure comprising a film with a design, a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, manufacturing the second plastic resin comprises:
- injection molding the second plastic resin according to a shape of a product, the injection molding comprising forming a penetrating hole in the second plastic resin;
- forming an electronic circuit, by a plating process, on a top side, or both sides including the top side and a bottom side of the second plastic resin that is injection molded;
- forming a protection layer on the electronic circuit formed on the bottom side of the second plastic resin when the electronic circuit is formed on the top and the bottom side of the second plastic resin, and
- mounting an electronic device on the top side, or the top and bottom side of the second plastic resin with the electronic circuit by soldering, in order to minimize heat damage to the top side, or the top and the bottom side of the second plastic resin with the electronic circuit, the soldering comprising:
- low temperature soldering using a low thermosetting soldering paste, or
- local area heating soldering that is heating only a local area where a soldering paste is applied.
A method of an in-mold electronic structure comprising a film with a design, a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, the method comprises:
- providing the film and the second plastic resin, each formed according to a shape of a product, and
- mounting the film on a top portion of a cavity of a mold and the second plastic resin on a bottom portion of the cavity, a shape of the cavity same as that of the product, and
- forming the first plastic resin and completing the in-mold electronic structure comprising the film, the first plastic resin, and the second plastic resin by injecting a material of the first plastic resin into the cavity, filling the cavity with the material, and molding the structure under a designated temperature and pressure.
Dependencies are inferred from the claim text.