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US 2022/0181290 A1Published application
Clip interconnect with micro contact heads
AssigneeSemiconductor Components Industries, LLC
InventorsEmmanuel Silvestre RAMOS, Ghizelle Jane Estrada ABARRO, Aaron Alabin BITAVARRA, Roxanna Samson CAGUIOA
Life of this patent
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Abstract
A furcated clip includes a removable collar, and an arrangement of stems attached to the removable collar. The stems are configured for contacting bond pads of a semiconductor die and connecting the bond pads to leadframe posts of a leadframe structure.
Claims20
A device package comprising:
- a semiconductor die, the semiconductor die including at least a bond pad forming an external electrical contact of an electronic device or circuit formed in the semiconductor die;
- a leadframe structure including at least a lead extending to an outside of the device package, the lead including a leadframe post;
- and
- a stem having a needle-like tip and a stem foot portion, the needle-like tip being attached to the bond pad, the stem foot portion being attached to the leadframe post, the stem electrically connecting the bond pad to the lead extending to the outside of the device package.
1 more element
A furcated clip comprising:
- a removable collar;
- and
- an arrangement of stems, each of the stems being configured for contacting a bond pad of a semiconductor die and connecting the bond pad to leadframe post of a leadframe structure, the arrangement of stems being attached to the removable collar.
A method for assembling a device package, comprises:
- attaching a semiconductor die to a leadframe structure to form a die-leadframe structure combination, the leadframe structure including at least one lead and an associated leadframe post;
- attaching a furcated clip to the die-leadframe structure combination, the furcated clip including at least a stem attached to a removable collar via a clip foot portion of the stem, the stem having a needle-like tip configured to contact and establish electrical connectivity with a bond pad on the semiconductor die, the stem having a stem foot portion adapted to be bonded to a leadframe post of the leadframe structure;
- attaching the needle-like tip of the stem to the bond pad on the semiconductor die;
- and
- forming an electrical connection from the bond pad on semiconductor die via the stem to the at least one lead by attaching the stem foot portion of the stem to a leadframe post.
2 more elements
Dependencies are inferred from the claim text.