Back to results
US 2022/0178993 A1Published application
Real time chuck temperature monitoring
AssigneeTexas Instruments Incorporated
InventorsGuan Da Lee, Adi Irwan Herman
Life of this patent
Estimating the term…
Abstract
A wafer probe test system includes a chuck to support a wafer, and a probe card having a first side to face the chuck, an opposite second side, and an aperture that extends between the first and second sides. The system also includes a probe head mounted to the first side of the probe card and having probe pins to contact a device under test of the wafer, and an infra-red thermal sensor facing the aperture of the probe card to sense a temperature of the wafer.
Claims20
A wafer probe test system, comprising:
- a chuck configured to support a wafer;
- a probe card having a first side configured to face the chuck, an opposite second side, and an aperture that extends along a first direction between the first and second sides of the probe card;
- a probe head mounted to the first side of the probe card, the probe head being spaced apart from the aperture along a second direction, the second direction being orthogonal to the first direction, the probe head having probe pins configured to contact a device under test (DUT) of the wafer;
- and
- an infra-red thermal sensor facing the aperture of the probe card to sense a temperature of the wafer.
2 more elements
A probe card, comprising
- a first side;
- an opposite second side;
- an aperture that extends along a first direction between the first and second sides of the probe card;
- a probe head mounted to the first side of the probe card, the probe head being spaced apart from the aperture along a second direction, the second direction being orthogonal to the first direction;
- and
- an infra-red thermal sensor facing the aperture.
3 more elements
A method of manufacturing a packaged electronic device, the method comprising:
- testing a device under test (DUT) of a wafer using a probe head of a probe card;
- sensing a temperature of the wafer through an aperture of the probe card using an infra-red thermal sensor;
- separating dies from the wafer;
- attaching one of the dies to a die attach pad or a substrate;
- and
- performing a molding process that creates a molded structure that encloses a portion of the one of the dies.
3 more elements
Dependencies are inferred from the claim text.