Electronic device comprising wire links
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorsAlexandre AYRES, Bertrand BOROT
Life of this patent
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Abstract
An integrated circuit chip is attached to a support that includes first conductive elements. First conductive pads are located on the integrated circuit chip and are electrically coupled to the first conductive elements by conductive wires. The integrated circuit chip further includes a conductive track. A switch circuit is provided to selectively electrically connect each first conductive pad to the conductive track. To test the conductive wires, a group of first conductive pads are connected by their respective switch circuits to the conductive track and current flow between corresponding first conductive elements is measured.
Claims18
A device, comprising:
- a support including first conductive elements located on a first surface of the support;
- an integrated circuit chip attached to the support, the integrated circuit chip including first conductive pads;
- conductive wires coupling the first conductive pads to the first conductive elements;
- a conductive track located on the integrated circuit chip;
- and
- switching circuitry including a plurality of switch circuits, each switch circuit configured to selectively connect one of the first conductive pads to the conductive track.
A method of testing a device which includes:
- an integrated circuit chip attached to a support;
- first conductive elements located on a first surface of the support;
- first conductive pads located on the integrated circuit chip, the first conductive pads being coupled to the first conductive elements by conductive wires;
- a conductive track located on the integrated circuit chip;
- and switching circuitry including switch circuits configured to selectively connect each first conductive pad to the conductive track, the method comprising:
- actuating switch circuits associated with a group which includes at least two first conductive pads and deactuating all other switch circuits;
- supplying a current to the first conductive element coupled to one of the first conductive pads in the group;
- and
- measuring current flowing through the first conductive elements coupled to at least one of the other first conductive pads in the group.
Dependencies are inferred from the claim text.