Method for producing a sensor device and component and/or chassis component comprising a sensor device of this kind
AssigneeZF Friedrichshafen AG
InventorsMichael KLANK, Thomas KOEHNE
Life of this patent
Estimating the term…
Abstract
A method for producing a sensor device (2) for the measurement of an instantaneous load on a component (1, 15), in which the component (1, 15) is made of plastic, in which a sensor layer (3) is arranged in the component (1, 15). The sensor layer (3) is formed of a carrier material with electrically conductive particles embedded therein. To be able to measure or determine loads and/or forces in the component (1, 15) in a better an/or more reliable way, the method includes forming at least one blind hole-like recess (4) in the component (1, 15) to receive the sensor layer (3).
Claims12
1-10. (canceled)
A method for producing a sensor device (2) for measurement of an instantaneous load on a component (1, 15), in which the component (1, 15) is made of plastic and a sensor layer (3) is arranged in the component (1, 15), the method comprising:
- forming the sensor layer (3) with a carrier material having electrically conductive particles embedded therein, and
- forming at least one blind hole-like recess (4) in the component (1, 15) which receives the sensor layer (3).
A method of producing a sensor device which measures an instantaneous load on a component made of plastic, the method comprising:
- at least partially overmolding first and second electrically conducting sections, when forming the component, such that the first and the second electrically conducting sections are at least partially embedded within the component;
- forming a blind hole-like recess in the component such that an end of each of the first and the second electrically conducting sections is open to the blind hole-like recess;
- embedding electrically conductive particles within a liquid carrier material;
- at least partially filling the blind hole-like recess with the liquid carrier material such that the end of each of the first and the second electrically conducting sections contacting the liquid carrier material;
- and
- at least one of hardening and curing the liquid carrier material to form a sensor layer within the component.
Dependencies are inferred from the claim text.