Pressure sensor and packaging method thereof
AssigneeFatri United Testing & Control (Quanzhou) Technologies Co., Ltd.
InventorYongzhong NIE
Life of this patent
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Abstract
A pressure sensor and a packaging method thereof. The pressure sensor comprises: a sensitive chip, which comprises a thin-wall part and a supporting part connected to the periphery of the thin-wall part, the supporting part being provided with an electrode; a sealing element, which is fitted over the sensitive chip and partially surrounds together with the sensitive chip to form a sealing cavity, the sealing element being provided with a through hole corresponding to the electrode; a conductive component, which is provided in the through hole in a sealed mode and electrically connected to the electrode, the conductive component and the sealing element being arranged in an insulating mode, and the conductive component comprising a filling part and a leading-out part embedded in the filling part.
Claims10
A pressure sensor, comprising:
- a sensitive chip, comprising a thin wall portion and a supporting portion connected to an outer periphery of the thin wall portion, and the supporting portion being provided with an electrode;
- a sealing member, sleeved on the sensitive chip, part of the sealing member defining a sealed cavity together with the sensitive chip, and the sealing member being provided with a through hole corresponding to the electrode;
- a conductive member, disposed in the through hole in a sealing manner and electrically connected with the electrode, and the conductive member being insulated from the sealing member, wherein the conductive member comprises a filling portion and a lead-out portion embedded in the filling portion.
A packaging method of a pressure sensor, wherein the method comprises the following steps of:
- providing a sensitive chip, the sensitive chip comprising a thin wall portion and a supporting portion connected to an outer periphery of the thin wall portion, the supporting portion being provided with an electrode;
- sleeving a sealing member on the sensitive chip for pre-assembly processing, part of the sealing member defining a sealed cavity together with the sensitive chip, and the sealing member being provided with a through hole corresponding to the electrode;
- injecting a filling portion into the through hole and inserting a lead-out portion into the filling portion, and then vacuum sintering and solidifying the filling portion;
- and
- absolute pressure packaging the sensitive chip and the sealing member to form a pressure sensor.
Dependencies are inferred from the claim text.