Temperature sensing device and method for a hot stamping die apparatus

A temperature sensing device for a hot stamping die apparatus, wherein the hot stamping die apparatus comprises a first die and a second die, the second die is configured to move to the first die relatively, and the temperature sensing device comprises:

• a processor, wherein when the second die moves toward the first die to press a workpiece, a pushing signal is transmitted to the processor;
• at least one temperature sensing unit, disposed in the first die, and comprising:
• a moving rod;
• a buffer, having an end connected to the moving rod;
• and
• a temperature sensor, connected to the other end of the buffer, and electrically connected to the processor;
• a displacement regulator, configured to drive the moving rod, and enable the moving rod to move to the displacement regulator relatively;
• and
• a controller, coupled to the displacement regulator, and electrically connected to the processor, whereby after the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.