Devices, systems and methods for thermal management

A thermal management device, comprising:

• a baseplate in thermal communication with a heat source, wherein an area of said baseplate is divided into a plurality of zones,
• wherein a zone of said plurality of zones comprises a plurality of fins in thermal communication with said baseplate,
• wherein one or more ancillary structures are (i) disposed between at least two adjacent fins of said plurality of fins, and (ii) in thermal communication with at least one of said at least two adjacent fins and optionally with said baseplate,
• wherein said one or more ancillary structures are selected from the group consisting of:
• linear ridges, aerodynamic solids, chevrons, triangular prisms, lattices, pins, and helices,
• wherein said baseplate and said array of fins comprise a material exhibiting a thermal conductivity greater than about 200 W/m-K, and
• wherein said thermal management device is configured for a cooling fluid to flow through said thermal management device with a device flow rate and a device flow velocity.